Shielded audio apparatus

ABSTRACT

An apparatus including a transducer membrane for generating sound waves; and a plate, through which sound waves can pass, at least partially overlaying the transducer membrane configured to produce a magnetically shielded region so to impede particles reaching the transducer membrane.

FIELD OF THE APPLICATION

The present application relates to a method and apparatus for magneticand electrostatic discharge shielding. In some embodiments the methodand apparatus relate to a magnetic and electrostatic discharge shieldingfor transducers.

BACKGROUND OF THE APPLICATION

Some portable electronic devices comprise transducers such asloudspeakers and/or earpieces which are required to be small in size.Transducers are important components in electronic devices such asmobile phones for the purposes of playing back music or having atelephone conversation. The quality and loudness of a transducer in anelectronic device are important especially if a user listens to soundsgenerated by an electronic device at a distance from the electronicdevice.

Furthermore in portable devices dust and water protection is importantspecifically with regards to the transducers. However dust and othersmall particles (and water) can often reach the transducer componentsand cause component damage. In particular the dynamic moving coilcomponents in transducers radiate in each direction as the diaphragmmoves forwards and backwards and as the construction of the transducertypically has open outlets on either side of the transducer which arefree to air and the permanent magnet of a moving coil transducer canattract magnetic particles which migrate through the portable device andreach the coil and diaphragm. These particles can damage the sensitivecomponents and/or reduce the performance of these components when theapparatus is in operation.

For example after some time the force between magnetic dust on thediaphragm and the permanent magnet inside the electrodynamic loudspeakercan pull the diaphragm towards the magnet and make the sound quieter,cause distortion or both. These types of failure typically requiresrepair and are costly to the manufacturer of the device if the failureoccurs within the warranty period. Furthermore these features can causebrand damage if the failure occurs soon after the warranty period as theuser considers the device to have failed prematurely and of poorquality.

SUMMARY OF SOME EMBODIMENTS

In a first aspect of the application there is provided an apparatuscomprising a transducer membrane for generating sound waves: and aplate, through which sound waves can pass, at least partially overlayingthe transducer membrane configured to produce a magnetically shieldedregion to impede particles reaching the transducer membrane.

The plate may be located between the transducer membrane and anapparatus cover with at least one conduit configured to permit soundwaves to pass through the at least one plate.

The apparatus may further comprise a dust net located proximate to theat least one conduit configured to permit sound waves to pass throughthe dust net.

The apparatus may further comprise a cover comprising at least one coverconduit configured to permit sound waves to pass through the cover.

The at least one cover conduit and the plate conduit may be skewed withrespect to the relative direction to the transducer membrane.

The plate conduit edges may be coated by a material whose relativepermeability is lower than the plate.

The plate may comprise at least one of: a mu-metal plate; a materialwith high magnetic permeability; stainless steel grade SUS 310;stainless steel grade SUS 430; a permalloy plate; a high magneticpermeability metal alloy plate; a nano-crystaline grain structureferromagnetic metal coating; a shielding foil; an ultra-low carbon steelplate; an amumetal plate; an amunickel plate; a cryoperm plate; and aferrite (RFIC40 or GAR11030) plate.

The apparatus may further comprise: at least one transducer contactconfigured to supply a transducer comprising the transducer membranewith a signal; and at least one grounding contact wherein the plate isconductive and is further coupled to the at least one grounding contactsuch that an electrostatic discharge passes from the plate through thegrounding contact and away from the transducer.

The apparatus may further comprise at least two transducer contactsconfigured to supply a transducer comprising the transducer membranewith a signal.

The apparatus may further comprise: a support configured to support thetransducer comprising the transducer membrane, wherein the transducer iselectrically coupled to the support by at least one coupling coupled tothe at least one transducer contact and by at least one ground couplingcoupled to the transducer at least one grounding contact such that theelectrostatic discharge passes from the plate through the groundingcontact and away from the transducer by the at least one groundcoupling; and at least one audio driver further sported by the supportand configured to be coupled via the at least one coupling to the atleast one transducer contact.

The at least one transducer contact and the at least one groundingcontact may be a contact spring.

According to a second aspect there is provided a method comprising:providing a transducer membrane for generating sound waves; and locatinga plate, through which sound waves can pass, at least partiallyoverlaying the transducer membrane configured to produce a magneticallyshielded region to impede particles reaching the transducer membrane.

Providing the plate may comprise locating the plate between thetransducer membrane and an apparatus cover with at least one conduitconfigured to permit sound waves to pass through the plate.

The method may further comprise locating a dust net proximate to the atleast one conduit wherein the dust net is configured to permit soundwaves to pass through the dust net.

The method may further comprise providing a cover, wherein providing thecover comprises providing at least one cover conduit configured topermit sound waves to pass through the cover.

The method may further comprise skewing the at least one cover conduitand the plate conduit with respect to the relative direction to thetransducer membrane.

The method may comprise coating at least one edge of the plate conduitwith a material whose relative permeability is lower than the plate.

The plate may comprise at least one of: a mu-metal plate; a materialwith high magnetic permeability; stainless steel grade SUS 310;stainless steel grade SUS 430; a permalloy plate; a high magneticpermeability metal alloy plate; a nano-crystaline grain structureferromagnetic metal coating; a shielding foil; an ultra-low carbon steelplate; an amumetal plate; an amunickel plate; a cryoperm plate; and aferrite (RFIC40 or GAR11030) plate.

The method may further comprise: providing at least one transducercontact configured to supply a transducer comprising the transducermembrane with a signal; and providing at least one grounding contactwherein the plate is conductive and is further coupled to the at leastone grounding contact such that an electrostatic discharge passes fromthe plate through the grounding contact and away from the transducer.

Providing at least one transducer contact configured to supply atransducer comprising the transducer membrane with a signal may furthercomprise providing at least two transducer contacts configured to supplya transducer comprising the transducer membrane with a signal.

The method may further comprise: providing a support configured tosupport the transducer comprising the transducer membrane; electricallycoupling the transducer to the support by at least one coupling coupledto the at least one transducer contacts and by at least one groundcoupling coupled to the transducer at least one grounding contact suchthat the electrostatic discharge passes from the plate through thegrounding contact and away from the transducer by the at least oneground coupling; providing at least one audio driver further supportedby the support; and electrically coupling the at least one audio drivervia the at least one coupling to the at least one transducer contact.

The method may further comprise coupling by a contact spring at leastone of: the at least one transducer contact; and the at least onegrounding contact.

According to a third aspect there is provided an apparatus comprising:sound wave generating means: and plate means, through which sound wavescan pass, at least partially overlaying the sound wave generating means,wherein the plate means are configured to produce a magneticallyshielded region to impede particles reaching the sound wave generatingmeans.

The plate means may be located between the sound wave generating meansand the apparatus cover with at least one means to permit sound waves topass through the plate means.

The apparatus may further comprising dust net means located proximate tothe at least one conduit configured to permit sound waves to passthrough the dust net means.

The apparatus may further comprising cover means comprising at least oneconduit means configured to permit sound waves to pass through the covermeans.

The at least one cover conduit means and the at least one means topermit sound waves to pass through the plate means may be skewed withrespect to the relative direction to the sound wave generating means.

The plate means proximate to the at least one means to permit soundwaves to pass through the plate comprises a coating by a material whoserelative permeability is lower than the plate means.

The plate means may comprise at least one of: a mu-metal plate; amaterial with high magnetic permeability; stainless steel grade SUS 310;stainless steel grade SUS 430; a permalloy plate; a high magneticpermeability metal alloy plate; a nano-crystaline grain structureferromagnetic metal coating; a shielding foil; an ultra-low carbon steelplate; an amumetal plate; an amunickel plate; a cryoperm plate; and aferrite (RFIC40 or GAR11030) plate.

The apparatus may further comprise: at least one transducer contactmeans configured to supply the sound wave generating means with asignal; and at least one grounding contact means wherein the plate meansis conductive and is further coupled to the at least one groundingcontact means such that an electrostatic discharge passes from the platemeans through the at least one grounding contact means and away from thesound generating means.

The apparatus may further comprise: support means for supporting thesound generating means, wherein the sound generating means is configuredto be electrically coupled to the support by at least one coupling meanscoupled to the at least one transducer contact means and by at least oneground coupling means coupled to the sound generating means at least onegrounding contact means such that the electrostatic discharge passesfrom the plate means through the grounding contact means and away fromthe sound generating means by the at least one ground coupling means;and at least one audio driver means further supported by the supportmeans and configured to be coupled via the at least one coupling meansto the at least one transducer contact means.

The at least one transducer contact means and the at least one groundingcontact means may be a contact spring.

According to a fourth aspect there is provided an apparatus comprising:at least one display; at least one processor; at least one memorycoupled to the at least one processor; and at least one transducercomprising a transducer membrane for generating sound waves; and aplate, through which sound waves can pass, at least partially overlayingthe transducer membrane configured to produce a magnetically shieldedregion to impede particles reaching the transducer membrane.

The plate may be an integral plate.

An electronic device may comprise an apparatus as described above.

Embodiments of the present invention aim to address one or more of theabove problems.

BRIEF DESCRIPTION OF DRAWINGS

For a better understanding of the present application and as to how thesame may be carried into effect, reference will now be made by way ofexample to the accompanying drawings in which:

FIG. 1 illustrates a schematic block diagram of an apparatus accordingto some embodiments;

FIG. 2 illustrates a schematic diagram of a prior art magnetic shieldconfiguration;

FIG. 3 illustrates a schematic orthogonal projection diagram of anintegrated magnetic shield transducer configuration according to someembodiments of the application;

FIG. 4 illustrates a schematic orthogonal projection diagram of theunderside of the integrated magnetic shield transducer configuration asshown in FIG. 3;

FIG. 5 illustrates a schematic plan projection diagram of the undersideof the integrated magnetic shield transducer configuration as shown inFIGS. 3 and 4;

FIG. 6 illustrates a schematic orthogonal projection diagram of afurther integrated magnetic shield transducer configuration according tosome embodiments of the application;

FIG. 7 illustrates the electrostatic protective operation of theintegrated magnetic shield transducer configuration according to someembodiments of the application; and

FIGS. 8 and 9 illustrate electrostatic damage which can occur in currenttransducer configurations.

SOME EMBODIMENTS OF THE APPLICATION

The following describes apparatus and methods for magnetically shieldingand electrostatically protecting a transducer.

In providing magnetic shielding for speakers or transducers often aprotective mesh or other porous material, where appropriate, isimplemented to assist audio reproduction quality but maintain goodreliability of the transducer by protecting the transducer fromparticles entering through the sound outlets in the device. For examplea dust net can be placed in front of the loudspeaker. However the moreeffective a dust net is, in other words the denser the material used,the more attenuation to the sound generated by the speaker and thereforethe muffling of the speaker output occurs.

In some situations a complicated mechanical channel structure can beused to improve dust protection by making the route longer from theouter surface of the phone to the loudspeaker diaphragm. However longerchannel structures require additional volume within the device andfurthermore require the height or depth of the phone to be increased inorder to employ the additional channel length. These increaseddimensions are counter to the current design trend to make the phone asthin as possible in order to create a device which is as portable aspossible.

The use of magnetic shields have also been proposed (such as using aperforated μ-metal plate that lets sound pass through). The magneticshield can be placed in front of the loudspeaker and used to weaken thestray magnetic field and effectively alter the direction of theattractive force.

With respect to FIG. 2 an example transducer-shield combination isshown. In this example there is shown a transducer 101 which comprisesspeaker terminals 107 configured to operate as signal springs. In otherwords both mechanically support the transducer from the printed wiringboard (PWB) or printed circuit board (PCB) or flexible printed circuit(FPC) but to also provide the electrical coupling between the transducercoil and the amplifier (such as an integrated hands free amplifier) suchthat the transducer can be driven by the amplifier. It would beunderstood that whilst the embodiments shown here demonstrate the use ofsignal springs as speaker terminals that in some embodiments anysuitable coupling can be implemented, for example soldering such assurface mounted soldering or wire soldering can be employed.

In such an example to minimize the magnetic flux magnitude experiencedby the transducer a separate special (magnetic conducting) metal plate105 is located on top of the transducer 101. The metal plate 105 asshown is configured to have at least one hole or slot through which theacoustic waves generated by the transducer can pass. To bond the metalplate 105 to the transducer the structure typically requires an extrasheet of adhesive or poron 103 between transducer 101 (speaker) andmetal plate 105 to provide a suitable acoustic seal. It would berealised that the extra parts in terms of the metal plate and the sheetof adhesive or poron cause extra component and logistics cost andcomplexity in product design and assembly, and furthermore increase theheight of the transducer design.

Furthermore as well as dust and foreign material damage to thetransducer a further problem in modern transducer design reliability iselectrostatic discharge failure. An example of which can be seen in FIG.9. FIG. 9 shows an example transducer, an integrated hands free (INF)transducer 801, mounted on a PWB 601 via the transducer signal spring803. Furthermore on the printed wiring board 601 is a trace 605electrically coupling the transducer (IHF) signal spring 803 to atransducer (IHF) amplifier 603.

In the example shown in FIG. 9 an electrostatic discharge (ESD) sparkconnecting to the transducer (IHF) 801 can generate an ESD current 809shown in FIG. 9 as a dotted line which passes through the transducersignal spring 803 and the trace 605 to the transducer (IHF) amplifier603.

Examples of ESD sparks can be those generated during type approval andproduct reliability testing. These can easily break modern transducer(IHF or speaker) amplifier when conducting through the sound outlet tospeaker. The transducer amplifiers typically are not designed to handleESD currents generated by ESD sparks and very vulnerable to ESD shockdue to limitations in silicon area, cost, and increased digital signalprocessing (DSP) requirements on chip (such as audio DSP algorithms,speaker protection).

It has been proposed to fix the problem by adding passive components(such as ferrites, varistors) within the speaker lines (trace 605) toprotect the amplifier. These passive components are costly and theyrequire space on the PWB (PWB footprint) or flexible printed circuits“flex” (FPC), and require extra logistical effort, slow down productionand add complexity. Furthermore the audio performance of such systems islower than a simple circuit with less losses and resistance.

The addition of a floating metal plate above the transducer, such asshown in the magnetically shielded example in FIG. 2 will generally notimprove the ESD resistance of the system. An example ESD situation isshown in FIG. 8.

FIG. 8 shows an example transducer, an integrated hands free (IHF)transducer 701, mounted on a PWB 601 via the transducer signal spring703. The integrated hands free (IHF) transducer 701 can be seen with thenon-grounded (or floating) metal plate 705 located above the transducer701 and configured to provide some magnetic shielding to the transducer.Furthermore on the printed wiring board 601 is a trace 605 electricallycoupling the transducer (IHF) signal spring 703 to a transducer (IHF)amplifier 603.

In the example shown in FIG. 8 an electrostatic discharge (ESD) sparkconnecting to the non-grounded metal plate 705 would generate an ESDcurrent 709 shown in FIG. 8 as a dotted line which passes throughtransducer (IHF) 701 can the transducer signal spring 703 and the trace605 to the transducer (IHF) amplifier 603 and producing similar effectsto the application of a ESD spark to transducer without a plate.

Another way that has been proposed to protect the speaker from ESD sparkis to ground a metal plate in front of the speaker as discussed withrespect to FIG. 2 by adding a separate metal plate adds height anddesign complexity especially where the extra plate needs to beacoustically sealed to component by adhesive or poron layer which addsstill further height and design & assembly complexity. It would beappreciated that grounding the extra plate produces a further challengewith respect to design and assembly would not be possible in manycircumstances.

The concept with respect to the embodiments described herein is tomechanically and electrically integrate a metal plate to the transduceror speaker on a component level. The result of which is a transducerwith integrated magnetic shielding and furthermore integrated ESDprotection.

Thus in some embodiments the transducer with integrated metal plate isdesigned with a ‘third’ contact leg which is configured to ‘ground’ thefront metal plate on a PWB or flexible printed circuits “flex” (FPC).Grounding the metal plate thus produces a clear path for the ESD tofollow and avoid the ESD sensitive components.

The concept is such that embodiments provide a ready solution (fullyintegrated transducer or speaker component) that includes a groundedmetal plate for ESD protection and further magnetically shields thetransducer from metallic particles.

In such embodiments by integrating the shield plate on a component levelalso reduces the total height or Z-thickness of the transducer as noseparate adhesive/poron layer is needed between the speaker componentand shield plate.

FIG. 1 shows a schematic representation of an electronic device orapparatus 10 comprising a suitable transducer or speaker 11. Thetransducer 11 may be an integrated speaker such as an integrated handsfree (IHF) speaker (or loudspeaker or earpiece).

The transducer 11 in some embodiments can be any suitable speaker typecomprising a permanent magnet. Additionally or alternatively thetransducer 33 comprises a multifunction device (MFD) component havingany of the following; combined earpiece, integrated handsfree speaker,vibration generation means or a combination thereof.

The apparatus 10 in some embodiments can be a mobile phone, portableaudio device, or other means for playing sound. The apparatus 10includes an apparatus cover 22 and a cover conduit 24 acting as a soundoutlet for permitting sound waves to pass from the transducer 11 to theexterior environment. The apparatus 10 also includes a dust net 26located proximate to the cover conduit 24.

The apparatus 10 is in some embodiments a mobile terminal, mobile phoneor user equipment for operation in a wireless communication system.

In other embodiments, the apparatus 10 is any suitable electronic deviceconfigured to generate sound, such as for example a digital camera, aportable audio player (mp3 player), a portable video player (mp4 player)and a portable computer, for example a laptop PC. In some otherembodiments the apparatus 10 can be any suitable audio or audiosubsystem component or any suitable audio capture/audio rendering device

In some embodiments, the apparatus 10 comprises a sound generatingmodule 19 which is linked to a processor 15. The processor 15 can beconfigured to execute various program codes. The implemented programcodes may comprise a code for controlling the transducer 11 to generatesound waves. In some embodiments the sound generating module 19comprises a transducer protection module 20 for modifying the audiosignals for the transducer 11.

The implemented program codes in some embodiments 17 can be stored forexample in the memory 16 for retrieval by the processor 15 wheneverneeded. The memory 16 could further provide a section 18 for storingdata, for example data that has been processed in accordance with theembodiments. The code can, in some embodiments, be implemented at leastpartially in hardware or firmware.

In some embodiments the processor 15 is linked via a digital-to-analogueconverter (DAC) 12 to the transducer 11. The digital to analogueconverter (DAC) 12 can be any suitable converter.

In some embodiments the DAC 12 sends an electronic audio signal outputto the transducer 11 and on receiving the audio signal from the DAC 12,the transducer 11 generates acoustic waves. In other embodiments, theapparatus 10 receives control signals for controlling the transducer 11from another electronic device.

The processor 15 can be further linked to a transceiver (TX/RX) 13, to auser interface (UI) 14 and to a display (not shown). The user interface14 can enable a user to input commands or data to the apparatus 10. Anysuitable input technology can be employed by the apparatus 10. It wouldbe understood for example the apparatus in some embodiments could employat least one of a keypad, keyboard, mouse, trackball, touch screen,joystick and wireless controller to provide inputs to the apparatus 10.

Although the example transducer shown herein is shown as a speaker (inother words converting electrical or electronic signals into acousticwaves), it would be understood that in some embodiments the transduceris a microphone converting acoustic waves into electrical or electronicsignals.

With respect to FIG. 3 an isometric projection view of an exampletransducer according to some embodiments is shown. The transducer 201can be seen comprising an integrated metal layer or plate 203 over thetransducer. The integrated metal layer or plate 203 can for example formpart of the transducer cover or casing. In some embodiments theintegrated metal layer or plate can be formed from a μ-metal material.In some embodiments the integral conductive plate comprises at least oneof: a material with high magnetic permeability; stainless steel gradeSUS 310 plate; and stainless steel grade SUS 430 plate; a perm-alloyplate; a high magnetic permeability metal alloy plate; a nano-crystalinegrain structure ferromagnetic metal coating; a shielding foil; anultra-low carbon steel plate; an amumetal plate; an amunickel plate; acryoperm plate; and a ferrite (RFIC40 or GAR11030) plate. Furthermore ingeneral the material is one aiming to reduce or shielding the magneticfield density of the transducer components. The integrated metal layeror plate can comprise at least one narrow gap which is shaped to containor collect metal dust by means of concentrating the magnetic field tocertain regions on the surface. These concentrated magnetic fieldregions can be referred to as being the dust trap region.

Furthermore although FIG. 3 shows the transducer or speaker located inan orientation where the integrated metal layer or plate is above thetransducer magnet, coil and piston it would be understood that the termsabove and below are simply reference directions and do not limitembodiments of the application to any particular alignment ordirectional orientation.

With respect to FIG. 3 the integrated metal layer or plate 203 is shownwith four sound output holes. These four sound outlet holes are roundedrectangular shaped holes, however it would be understood that in someembodiments any suitable number, shape and arrangement of holes can beused to allow acoustic or sound waves to pass through the metal layer orplate 203. Thus in some embodiments the metal layer or plate 203 cancomprise outlet holes as a single hole, or at least one slit. In someembodiments the output holes can have integrated acoustic transparent oropaque covers such as wire mesh or wire-net to further reduce foreignbodies entering the transducer. It would be understood that in someembodiments the sound holes can be located or ported on at least oneside of the transducer. In the following examples the sound holes areported on an ‘upper’ surface or side of the transducer. However it wouldbe understood that the sound hole or sound holes in some embodiments canbe ported on any suitable surface or side of the transducer assembly.

With respect to FIG. 3 furthermore is shown the speaker or transducercoil signal springs 207. The speaker or transducer signal springs 207are configured to at least partially mechanically couple the transducerto a chassis or printed wiring board (PWB) or flexible printed circuits“flex” (FPC). Furthermore in some embodiments the speaker or transducersignal springs are configured to electrically couple the speaker coil toa suitable transducer amplifier. It would be understood that the chassisor printed wiring board (PWB) is an example of a suitable support onwhich the transducer can be supported. Other suitable support forms canfor example be printed circuit boards (PCB), or flexible printedcircuits “flex” (FPC). Furthermore as shown in FIG. 3 the speaker ortransducer signal springs (and furthermore the grounding spring) areexamples of suitable couplings between the transducer and the support.It would be understood that any suitable coupling or connection can beemployed in some embodiments such as wires and leafs.

In the example shown in FIG. 3 a single signal spring 207 is shownlocated along a short side (width) of the transducer however it would beunderstood that there are at least two signal springs, where at leastone is defined as a positive terminal signal spring coupled to one endof the transducer coil and at least one signal spring defined as anegative terminal signal spring coupled to the opposite end of thetransducer coil. It would be understood that in some embodiments thesignal spring(s) 207 can be located at any suitable position on theunderside of the transducer such that the transducer can rest ormechanically be supported by the signal springs when located on theprinted wiring board.

Furthermore FIG. 3 shows the transducer comprising at least onegrounding spring 205. The at least one grounding spring 205 can in someembodiments be electrically coupled via internal wiring to the metalplate or layer 203. For example in some embodiments the integral metalplate or layer 203 forms integrally the upper half of the transducercasing or support structure which is connected via a suitable electricalpathway to the at least one grounding spring 205. The grounding spring205 can in such embodiments form a third or further ‘leg’ furtherproviding mechanical stability for the transducer as it rests on theprinted wiring board.

This can be further shown with respect to FIG. 4 which shows anisometric projection from the underside of the transducer. The undersideof the transducer shows that there can be two grounding springs 205which are internally electrically connected to the integrated metallayer or plate 203. These grounding springs are shown forming a suitablemechanical support for the long sides (length) of the transducer, wherethe signal springs 207 a and 207 b form suitable mechanical support forthe short sides (width) of the transducer.

Furthermore with respect to FIG. 5 a plan projection of the underside ofthe example transducer is shown where the positive terminal signalspring 207 a and the negative signal spring 207 b are shown on opposite(short or width) sides of the transducer and the two grounding springs205 are shown on opposite sides to each other on the long or lengthsides of the transducer thus forming four suitable points of contactwhen the transducer is located on the printed wiring board.

In the examples shown herein the signal springs and he grounding springsare shown having a leaf spring configuration. However it would beunderstood that in some embodiments the profile of the springs can beany suitable shape or form suitable for providing an electrical contact.

With respect to FIG. 6 a further example of the integrated transducer401 is shown comprises an integrated metal layer or plate 403, agrounding spring 405, and a signal spring 407. The example shown in FIG.6 differs from the examples shown in FIGS. 3 to 5 in that the electricalcoupling between the integrated metal layer or plate 403 and thegrounding spring 405 is external to the transducer. In the example shownin FIG. 6 the grounding spring 405 is externally electrically coupled tothe integrated metal layer or plate 403 by providing a wide bended metalstrip 409 between the grounding spring 405 and the integrated metallayer or plate 403. In such a manner the external coupling 409 can beconfigured to provide good conduction from the integrated metal layer orplate 403 to the grounding spring 405.

With respect to FIG. 7 an example transducer according to someembodiments mounted within a suitable system is shown experiencing anelectrostatic discharge. In such embodiments the integrated hands free(IHF) transducer 201/401 or any suitable audio amplifier or audio driveris mounted on a PWB 601 (or suitable support such as a flexible printedcircuits “flex” (FPC)) via the transducer signal springs 207/407 and thegrounding spring(s) 205/405 (or suitable coupling). The integrated handsfree (IHF) transducer 201/401 can be seen with the integrated ESD metalplate 203/403 located above the transducer 201/401 and configured toprovide some magnetic shielding to the transducer. Furthermore on theprinted wiring board 601 or flexible printed circuits “flex” (FPC) is atrace 605 electrically coupling the transducer (IHF) signal spring207/407 to a transducer (IHF) amplifier 603. Furthermore on the printedwiring board 601 is a ground layer 607 which is coupled to the groundingspring(s) 205/405.

In the examples as shown with respect to FIG. 7 there are two transducersignal springs and thus two couplings to two contacts with respect tosupplying the transducer a signal. However it would be understood thatin some embodiments more than two couplings and more than two contactscan be employed. Furthermore in some embodiments at least one of thecouplings (such as signal springs) and contacts can be the groundingcoupling (or grounding spring) and contact respectively.

In the example shown in FIG. 7 an electrostatic discharge (ESD) sparkconnecting to the integrated metal plate 203/403 would generate an ESDcurrent 609 shown in FIG. 7 as a dotted line which passes through thegrounding spring 205/405 to ground layer 607. In such a manner thetransducer (IHF) amplifier 603 and any other ESD sensitive devices canbe protected from the ESD and associated harmful current.

In some embodiments there may be a combination of one or more of thepreviously described embodiments.

It shall be appreciated that the term portable device is user equipment.The user equipment is intended to cover any suitable type of wirelessuser equipment, such as mobile telephones, portable data processingdevices or portable web browsers. Furthermore, it will be understoodthat the term acoustic sound channels is intended to cover soundoutlets, channels and cavities, and that such sound channels may beformed integrally with the transducer, or as part of the mechanicalintegration of the transducer with the device.

In general, the various embodiments may be implemented in hardware orspecial purpose circuits, software, logic or any combination thereof.Some aspects of the invention may be implemented in hardware, whileother aspects may be implemented in firmware or software which may beexecuted by a controller, microprocessor or other computing device,although the invention is not limited thereto. While various aspects ofthe invention may be illustrated and described as block diagrams, flowcharts, or using some other pictorial representation, it is wellunderstood that these blocks, apparatus, systems, techniques or methodsdescribed herein may be implemented in, as non-limiting examples,hardware, software, firmware, special purpose circuits or logic, generalpurpose hardware or controller or other computing devices, or somecombination thereof.

The embodiments of this invention may be implemented by computersoftware executable by a data processor of the mobile device, such as inthe processor entity, or by hardware, or by a combination of softwareand hardware.

For example, in some embodiments the method of manufacturing theapparatus may be implemented with processor executing a computerprogram.

Further in this regard it should be noted that any blocks of the logicflow as in the Figures may represent program steps, or interconnectedlogic circuits, blocks and functions, or a combination of program stepsand logic circuits, blocks and functions. The software may be stored onsuch physical media as memory chips, or memory blocks implemented withinthe processor, magnetic media such as hard disk or floppy disks, andoptical media such as for example DVD and the data variants thereof, CD.

The memory may be of any type suitable to the local technicalenvironment and may be implemented using any suitable data storagetechnology, such as semiconductor-based memory devices, magnetic memorydevices and systems, optical memory devices and systems, fixed memoryand removable memory. The data processors may be of any type suitable tothe local technical environment, and may include one or more of generalpurpose computers, special purpose computers, microprocessors, digitalsignal processors (DSPs), application specific integrated circuits(ASIC), gate level circuits and processors based on multi-core processorarchitecture, as non-limiting examples.

Embodiments of the inventions may be practiced in various componentssuch as integrated circuit modules. The design of integrated circuits isby and large a highly automated process. Complex and powerful softwaretools are available for converting a logic level design into asemiconductor circuit design ready to be etched and formed on asemiconductor substrate.

Programs, such as those provided by Synopsys, Inc. of Mountain View,Calif. and Cadence Design, of San Jose, Calif. automatically routeconductors and locate components on a semiconductor chip using wellestablished rules of design as well as libraries of pre-stored designmodules. Once the design for a semiconductor circuit has been completed,the resultant design, in a standardized electronic format (e.g., Opus,GDSII, or the like) may be transmitted to a semiconductor fabricationfacility or “fab” for fabrication.

As used in this application, the term ‘circuitry’ refers to all of thefollowing:

-   -   (a) hardware-only circuit implementations (such as        implementations in only analog and/or digital circuitry) and    -   (b) to combinations of circuits and software (and/or firmware),        such as: (i) to a combination of processor(s) or (ii) to        portions of processor(s)/software (including digital signal        processor(s)), software, and memory(ies) that work together to        cause an apparatus, such as a mobile phone or server, to perform        various functions and    -   (c) to circuits, such as a microprocessor(s) or a portion of a        microprocessor(s), that require software or firmware for        operation, even if the software or firmware is not physically        present.

This definition of ‘circuitry’ applies to all uses of this term in thisapplication, including any claims. As a further example, as used in thisapplication, the term ‘circuitry’ would also cover an implementation ofmerely a processor (or multiple processors) or portion of a processorand its (or their) accompanying software and/or firmware. The term‘circuitry’ would also cover, for example and if applicable to theparticular claim element, a baseband integrated circuit or applicationsprocessor integrated circuit for a mobile phone or similar integratedcircuit in server, a cellular network device, or other network device.

The foregoing description has provided by way of exemplary andnon-limiting examples a full and informative description of theexemplary embodiment of this invention. However, various modificationsand adaptations may become apparent to those skilled in the relevantarts in view of the foregoing description, when read in conjunction withthe accompanying drawings and the appended claims. However, all such andsimilar modifications of the teachings of this invention will still fallwithin the scope of this invention as defined in the appended claims.Indeed in there is a further embodiment comprising a combination of oneor more of any of the other embodiments previously discussed.

The invention claimed is:
 1. An apparatus comprising: a transducermembrane for generating sound waves; and a plate, through which soundwaves can pass, at least partially overlaying the transducer membrane,the plate having at least one plate conduit configured to permit soundwaves to pass through the plate; at least one electrical contactconfigured to supply a signal to a transducer comprising the transducermembrane to drive the transducer membrane to generate the sound waves;and the plate is conductive and is coupled to at least one groundingcontact integrated at component level with the plate such that anelectrostatic discharge passes from the plate through the at least onegrounding contact without passing through the transducer membrane or theat least one electrical contact, so as to protect the transducermembrane from the electrostatic discharge; wherein the at least onegrounding contact integrated at component level with the plate comprisesat least one grounding contact electrically coupled via internal wiringto the plate.
 2. The apparatus as claimed in claim 1, further comprisinga dust net located proximate to the at least one plate conduitconfigured to permit sound waves to pass through the dust net.
 3. Theapparatus as claimed in claim 1, further comprising an apparatus covercomprising at least one apparatus cover conduit configured to permitsound waves to pass through the apparatus cover.
 4. The apparatus asclaimed in claim 3 wherein the at least one apparatus cover conduit andthe at least one plate conduit are skewed with respect to the relativedirection to the transducer membrane.
 5. The apparatus as claimed inclaim 1, further comprising: a support configured to support thetransducer, wherein the transducer is electrically coupled to thesupport by at least one coupling coupled to the at least one electricalcontact, and further supported by at least one ground coupling coupledto the at least one grounding contact such that the electrostaticdischarge passes from the plate through the at least one groundingcontact and away from the transducer by the at least one groundcoupling; and at least one audio driver supported by the support andconfigured to be coupled via the at least one coupling to the at leastone electrical contact.
 6. The apparatus as claimed in claim 1, whereinat least one of the at least one electrical contact and the at least onegrounding contact is a contact configured to mechanically support thetransducer.
 7. The apparatus as claimed in claim 6, wherein the at leastone electrical contact comprises a first electrical contact defined as apositive terminal coupled to a first end of a transducer coil and asecond electrical contact defined as a negative terminal coupled to asecond end of the transducer coil.
 8. The apparatus as claimed in claim1, wherein the plate is an integral plate.
 9. The apparatus as claimedin claim 1, wherein the at least one grounding contact integrated atcomponent level with the plate is a contact leg configured to ground theplate on a printed wire board or on a flexible printed circuit.
 10. Theapparatus as claimed in claim 1, wherein the plate comprises a pluralityof sound outlet holes through which the generated sound waves can pass.11. The apparatus as claimed in claim 10, further comprising integratedacoustically transparent covers over the sound outlet holes.
 12. Theapparatus as claimed in claim 1, wherein the at least one groundingcontact provides mechanical stability for the transducer as thetransducer rests on a printed wiring board.
 13. The apparatus as claimedin claim 1, wherein the at least one grounding contact comprises twogrounding contacts electrically connected to the plate and supportinglonger sides of the transducer, and wherein the at least one electricalcontact comprises two electrical contacts electrically connected to anamplifier and supporting shorter sides of the transducer.
 14. Theapparatus as claimed in 1, wherein the at least one grounding contact isat least one of a bent metal strip, a transducer signal spring, agrounding spring, a contact spring, and a leaf spring.
 15. A methodcomprising: providing a transducer membrane for generating sound waves;and locating a plate, through which sound waves can pass, at leastpartially overlaying the transducer membrane, the plate having at leastone plate conduit configured to permit sound waves to pass through theplate; providing at least one electrical contact configured to supply asignal to a transducer comprising the transducer membrane to drive thetransducer membrane to generate the sound waves; and the plate isconductive and is coupled to at least one grounding contact integratedat component level with the plate such that an electrostatic dischargepasses from the plate, through the at least one grounding contactwithout passing through the transducer membrane or the at least oneelectrical contact, so as to protect the transducer membrane from theelectrostatic discharge; wherein the at least one grounding contactintegrated at component level with the plate comprises at least onegrounding contact electrically coupled via internal wiring to the plate.16. The method as claimed in claim 15, further comprising locating adust net proximate to the at least one plate conduit wherein the dustnet is configured to permit sound waves to pass through the dust net.17. The method as claimed in claim 15, wherein the plate is an integralplate.
 18. An apparatus comprising: at least one processor; at least onenon-transitory memory coupled to the at least one processor; and atleast one transducer comprising a transducer membrane for generatingsound waves; and a plate, through which sound waves can pass, at leastpartially overlaying the transducer membrane, the plate having at leastone plate conduit configured to permit sound waves to pass through theplate; at least one electrical contact configured to supply a signal toa transducer comprising the transducer membrane to drive the transducermembrane to generate the sound waves; and the plate is conductive and iscoupled to at least one grounding contact integrated at component levelwith the plate such that an electrostatic discharge passes from theplate through the at least one grounding contact without passing throughthe transducer membrane or the at least one electrical contact, so as toprotect the transducer membrane from the electrostatic discharge;wherein the at least one grounding contact integrated at component levelwith the plate comprises at least one grounding contact electricallycoupled via internal wiring to the plate.
 19. The apparatus as claimedin claim 18, wherein the plate is an integral plate.